Method of forming inorganic alignment film, inorganic alignment film, substrate for electronic device, liquid crystal panel and electronic apparatus

ABSTRACT

A method of forming an inorganic alignment film made substantially of an inorganic material on a base substrate is provided comprising a milling process of irradiating ion beams onto the surface of the base substrate, on which the inorganic alignment film is to be formed, from a direction inclined at a predetermined angle θ b  with respect to a direction vertical to the surface, and a film-forming process of forming the inorganic alignment film on the base substrate onto which the ion beams are irradiated. In the milling process, the predetermined angle θ b  is preferably 2° or more. In the milling process, an acceleration voltage of the ion beams during the irradiation of the ion beams is preferably 400 to 1400 V.

RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No.2003-313316 filed Sep. 4, 2003 which is hereby expressly incorporated byreference herein in its entirety.

TECHNICAL FIELD

The present invention relates to a method of forming an inorganicalignment film, an inorganic alignment film, a substrate for anelectronic device, a liquid crystal panel, and an electronic apparatus.

BACKGROUND ART

A projection display device in which an image is projected on a screenis known. In the projection display device, a liquid crystal panel ismainly used to form an image.

Normally, such a liquid crystal panel has an alignment film which is setto have a predetermined pretilt angle, thereby aligning liquid crystalmolecules in a desired direction. In manufacturing the alignment film, amethod of rubbing a thin film made of a polymer compound such aspolyimide which is formed on a substrate in a direction by using a clothsuch as rayon is known (for example, see Japanese Unexamined PatentApplication Publication No. 10-161133 (claims)).

However, the alignment film made of a polymer compound such as polyimidecommonly causes optical deterioration according to the environment andduration of use. When optical deterioration occurs, materialsconstituting the alignment film, the liquid crystal layer and so ondecompose and adversely affect the performance of liquid crystal or thelike.

Further, static electricity or dust particles are generated by therubbing process, which may result in lowering the reliability of thedisplay devices.

It is an object of the present invention to provide an inorganicalignment film having excellent light resistance and capable ofcontrolling a pretilt angle more effectively, a substrate for anelectronic device having the inorganic alignment film, a liquid crystalpanel and an electronic apparatus. Further, it is another object of thepresent invention to provide a method of forming the inorganic alignmentfilm.

SUMMARY

These objects can be achieved by the present invention described below.

A method of forming an inorganic alignment film made substantially of aninorganic material on a base substrate according to the presentinvention comprises a milling step of irradiating ion beams onto thesurface of the base substrate, on which the inorganic alignment film isformed, from a direction inclined at a predetermined angle θ_(b) withrespect to a direction vertical to the surface, and a film-forming stepof forming the inorganic alignment film on the base substrate onto whichthe ion beams are irradiated.

Thus, it is possible to obtain an inorganic alignment film havingexcellent light resistance and capable of reliably controlling thepretilt angle.

In the method of forming an inorganic alignment film of the presentinvention, in the milling step, concave portions having a predetermineddirectivity may be formed in the base substrate by irradiating the ionbeams onto the base substrate.

Therefore, it is possible to form an inorganic alignment film having anexcellent ability for regulating the alignment properties of the liquidcrystal molecules.

In the method of forming an inorganic alignment film of the presentinvention, in the milling step, the predetermined angle θ_(b) ispreferably 2° or more.

Therefore, it is possible to form concave portions having apredetermined directivity more efficiently and to form a suitablepretilt angle more efficiently.

In the method of forming an inorganic alignment film of the presentinvention, in the milling step, an acceleration voltage of the ion beamsduring the irradiation of the ion beams is preferably 400 to 1400 V.

Therefore, it is possible to form each concave portion with a suitableinclined surface more efficiently.

In the method of forming an inorganic alignment film of the presentinvention, in the milling step, the current of the ion beams to beirradiated is preferably 100 to 1000 mA.

As a result, the inorganic alignment film can more effectively regulatethe alignment properties of the liquid crystal molecules.

In the method of forming an inorganic alignment film of the presentinvention, in the milling step, the pressure of an atmosphere in thevicinity of the base substrate is preferably 5.0×10⁻³ Pa or less.

Therefore, it is possible to improve the rectilinearity of the ionbeams, and thus it is possible to form the concave portions having apredetermined directivity more efficiently.

In the method of forming an inorganic alignment film of the presentinvention, in the film-forming step, the inorganic alignment film ispreferably formed by a sputtering method.

Therefore, it is possible to form the inorganic alignment film moreefficiently.

In the method of forming an inorganic alignment film of the presentinvention, the inorganic material may be substantially composed ofsilicon oxide.

Therefore, a resulting liquid crystal panel has an even more excellentlight resistance.

An inorganic alignment film of the present invention is formed by amethod of forming an inorganic alignment film of the present invention.

Therefore, it is possible to provide the inorganic alignment film havingexcellent light resistance and capable of effectively controlling thepretilt angle.

In the inorganic alignment film of the present invention, the averagethickness of the inorganic alignment film is preferably 0.02 to 0.3 μm.

Therefore, it is possible to form a more suitable pretilt angle and alsocontrol the alignment state of the liquid crystal molecules moreaccurately.

A substrate for an electronic device of the present invention compriseselectrodes and an inorganic alignment film of the present invention on asubstrate.

Therefore, it is possible to provide the substrate for an electronicdevice with excellent light resistance.

A liquid crystal panel of the present invention comprises an inorganicalignment film of the present invention and a liquid crystal layer.

Therefore, it is possible to provide a liquid crystal panel havingexcellent light resistance.

A liquid crystal panel of the present invention comprises a pair ofinorganic alignment films, each being formed by a method of forming aninorganic alignment film according to the present invention, and aliquid crystal layer interposed between the pair of inorganic alignmentfilms.

Therefore, it is possible to provide a liquid crystal panel havingexcellent light resistance.

An electronic apparatus of the present invention comprises a liquidcrystal panel of the present invention.

Therefore, it is possible to provide an electronic apparatus with highreliability.

An electronic apparatus of the present invention comprises light valveseach having a liquid crystal panel of the present invention in which animage is projected using at least one of the light valves.

Therefore, it is possible to provide an electronic apparatus having ahigh reliability.

An electronic apparatus of the present invention comprises three lightvalves, corresponding to red, green and blue, which form an image, alight source, a color separating optical system for separating lightfrom the light source into red, green and blue light components andguiding each light to the corresponding light valve, a colorsynthesizing optical system for synthesizing the image, and a projectingoptical system for projecting the synthesized image, each light valvecomprising a liquid crystal panel of the present invention.

Therefore, it is possible to provide an electronic apparatus with highreliability.

According to the present invention, it is possible to provide aninorganic alignment film having excellent light resistance and capableof controlling a pretilt angle more effectively, a substrate for anelectronic device comprising the inorganic alignment film, a liquidcrystal panel and an electronic apparatus. Further, it is possible toprovide a method of forming the inorganic alignment film.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic longitudinal cross-sectional view showing a firstembodiment of a liquid crystal panel according to the present invention.

FIG. 2 is a partial longitudinal cross-sectional view showing aninorganic alignment film formed by a method according to the presentinvention.

FIG. 3 is a perspective view showing schematically a surface state of abase substrate.

FIG. 4 is a schematic view of a milling device which is used to formconcave portions in the base substrate.

FIG. 5 is a schematic view of an ion beam sputter device for forming aninorganic alignment film.

FIG. 6 is a schematic longitudinal cross-sectional view showing a secondembodiment of a liquid crystal panel according to the present invention.

FIG. 7 is a perspective view showing a construction of a mobile ornotebook personal computer to which an electronic apparatus according tothe present invention is applied.

FIG. 8 is a perspective view showing a construction of a cellular phone,also including a Personal Handyphone System (PHS), to which anelectronic apparatus according to the present invention is applied.

FIG. 9 is a perspective view showing a construction of a digital stillcamera to which an electronic apparatus according to the presentinvention is applied.

FIG. 10 is a view showing schematically an optical system of aprojective display device to which an electronic apparatus according tothe present invention is applied.

DETAILED DESCRIPTION

A method of forming an inorganic alignment film, a substrate for anelectronic device, a liquid crystal panel and an electronic apparatuswill now be described in detail with reference to the attached drawings.

First, prior to describing the method of forming the inorganic alignmentfilm, the liquid crystal panel of the present invention will bedescribed.

FIG. 1 is a schematic longitudinal cross-sectional view showing a firstembodiment of the liquid crystal panel according to the presentinvention. FIG. 2 is a partial longitudinal cross-sectional view showingan inorganic alignment film formed by a method according to the presentinvention. FIG. 3 is a perspective view showing schematically a surfacestate of the base substrate. Hereinafter, an upper side and a lower sidein FIG. 2 are referred as ‘an upper portion’ and ‘a lower portion’,respectively.

As shown in FIG. 1, a liquid crystal panel 1A has a liquid crystal layer2, inorganic alignment films 3A and 4A, transparent conductive films 5and 6, polarizing films 7A and 8A, and substrates 9 and 10.

The liquid crystal layer 2 is substantially made of liquid crystalmolecules.

The liquid crystal molecules constituting the liquid crystal layer 2include liquid crystal molecules obtained by aligning nematic liquidcrystal, smectic liquid crystal or the like, but, in a TN liquid crystalpanel, it is preferable to form nematic liquid crystal. For example,phenylcyclohexane derivative liquid crystal, biphenyl derivative liquidcrystal, biphenylcyclohexane derivative liquid crystal, terphenylderivative liquid crystal, phenylether derivative liquid crystal,phenylester derivative liquid crystal, bicyclohexane derivative liquidcrystal, azomethine derivative liquid crystal, azoxy derivative liquidcrystal, pyrimidine derivative liquid crystal, dioxane derivative liquidcrystal, and cubane derivative liquid crystal are included. The liquidcrystal molecules obtained by introducing fluoric substituent such as amonofluoro group, a difluoro group, a trifluoro group, a trifluoromethylgroup, a trifluoromethoxy group, and a difluoromethoxy group into thenematic liquid crystal are included.

On both surfaces of the liquid crystal layer 2, the inorganic alignmentfilms 3A and 4A are arranged. Further, the inorganic alignment film 3Ais formed on a base substrate 100 comprising the transparent conductivefilm 5 and the substrate 9 as described below, and the inorganicalignment film 4A is formed on a base substrate 101 comprising thetransparent conductive film 6 and the substrate 10 as described below.

The inorganic alignment films 3A and 4A have a function regulating analignment state of the liquid crystal molecules constructing the liquidcrystal layer 2 when a voltage is not applied.

Such inorganic alignment films 3A and 4A are formed, for example, by amethod described below, that is, a method of forming an inorganicalignment film of the present invention. As shown in FIG. 2, thesurfaces of the inorganic alignment film 3A and 4A have spaces capableof regulating the alignment state of the liquid crystal molecules. Theshapes of the inorganic alignment film 3A and 4A respectively correspondto the shapes of the surfaces of the transparent conductive films 5 and6.

The inorganic alignment films 3A and 4A are substantially made of aninorganic material. Since the inorganic material generally has excellentchemical stability as compared with an organic material, the inorganicalignment films 3A and 4A have excellent light resistance as comparedwith an alignment film made of the organic material.

As the inorganic material described above, for example, silicon oxidesuch as SiO₂ and SiO, or metallic oxide such as MgO and ITO can be used.Among them, in particular, it is preferable to use silicon oxide. Thus,it is possible to allow resulting liquid crystal panels to have moreexcellent light resistance.

The average thickness of such an inorganic alignment film 3A or 4A ispreferably 0.02 to 0.3 μm, and more preferably, 0.02 to 0.08 μm. If theaverage thickness is less than a lower limit value, it may be difficultto make the pretilt angle in each portion sufficiently uniform.Meanwhile, if the average thickness exceeds an upper limit value, adriving voltage may rise, and thus a consumption power may increase.

On an outer surface of the inorganic alignment film 3A (a surfaceopposite to a surface facing the liquid crystal layer 2), thetransparent conductive film 5 is arranged. Similarly, on an outersurface of the inorganic alignment film 4A (a surface opposite to asurface facing the liquid crystal layer 2), the transparent conductivefilm 6 is arranged.

The transparent conductive films 5 and 6 have a function for driving(changing the alignment of) the liquid crystal molecules of the liquidcrystal layer 2 when an electrical conduction is performed between thetransparent conductive films 5 and 6.

A control of the electrical conduction between the transparentconductive films 5 and 6 is performed by controlling the current to besupplied from a control circuit (not shown) which is connected to thetransparent conductive films.

The transparent conductive films 5 and 6 have a conductive property, andare made of, for example, indium tin oxide (ITO), indium oxide (IO), tinoxide (SnO₂) or the like.

On an outer surface of the transparent conductive film 5 (a surfaceopposite to a surface facing the inorganic alignment film 3A), thesubstrate 9 is arranged. Similarly, on an outer surface of thetransparent conductive film 6 (a surface opposite to a surface facingthe inorganic alignment film 4A), the substrate 10 is arranged.

As shown in FIG. 3, the transparent conductive film 5 has a plurality ofconcave portions 51 having a predetermined directivity at randompositions on a surface contacting the inorganic alignment film 3A.Similarly, the transparent substrate 6 has also a plurality of concaveportions 61 having a predetermined directivity at random positions on asurface contacting the inorganic alignment film 4A. Thus, it is possibleto form the inorganic alignment film 3A and 4A having excellentregulation ability to the alignment properties of the liquid crystalmolecules.

As shown in FIG. 2, the concave portions 51 and 61 respectively have asurface (an inclined surface) inclined at a predetermined angle θ_(d) toa direction parallel to the respective surfaces of the transparentconductive films 5 and 6. If the transparent conductive films 5 and 6have such concave portions, it is possible to form more surely theinorganic alignment films 3A and 4A capable of allowing the suitablepretilt angle to be expressed.

Further, the inclination direction of the inclined surface of eachconcave portion is substantially arranged in order on the respectivetransparent conductive films, as shown in FIG. 3. Thus, each concaveportion has a predetermined directivity. As a result, it is possible toregulate the alignment properties of the liquid crystal molecules moresurely.

The inclination angle θ_(d) of the inclined surface is not specificallylimited, but it is preferably 2 to 30°, and more preferably, 2 to 10°.Thus, it is possible to form more surely the inorganic alignment films3A and 4A capable of forming the suitable pretilt angle.

Further, as seen from the upper portion of FIG. 2 in a plan view, theaverage width (an average of maximum width) W₁ of the concave portions51 and 61 in the inclination direction of the inclined surface arepreferably 5 to 500 nm, and more preferably, 8 to 20 nm. Thus, it ispossible to further improve the alignment properties of the liquidcrystal molecules.

Further, as seen from the upper portion of FIG. 2 in a plan view, theaverage width (an average of maximum width) W₂ of the concave portions51, 61 in a direction orthogonal to the inclination direction of theinclined surface are preferably 5 to 500 nm, and more preferably, 8 to20 nm. Thus, it is possible to improve the alignment properties of theliquid crystal molecules. To the contrary, if the width W₂ is too small,it may be difficult to control the alignment state (the pretilt angle)of the liquid crystal molecules when a voltage is not applied.Meanwhile, if the width W₂ is too large, it may be difficult to alignthe liquid crystal molecules in a predetermined direction.

Further, in the present embodiment, the concave portions formed at therandom positions on the base substrate are described, but the concaveportions may be regularly formed.

By the way, adjacent liquid crystal molecules naturally tend to have thesame directivity and the alignment property of all of the liquidcrystals increases when the liquid crystal molecules entirely orpartially enter into the concave portions as described above. Therefore,like the present embodiment, if the concave portions are formed atrandom positions on the base substrate, it is possible to form theconcave portions relatively easily in the method described below, and itis also possible to make the alignment properties of the liquid crystalmolecules good.

The substrates 9 and 10 have a function for supporting theabove-mentioned liquid crystal layer 2, the inorganic alignment films 3Aand 4A, the transparent conductive films 5 and 6, and the polarizingfilms 7A and 8A described below. The material of the substrates 9 and 10is not specifically limited, but it may include a glass material such asquartz glass or a plastic material such as polyethyleneterephthalate.Among them, it is preferable to use a glass material such as quartzglass. Thus, it is possible to obtain the liquid crystal panel havingexcellent stability in which curving or bending is almost nevergenerated. It should be noted that in FIG. 1 a sealing material, wiringlines and so on are omitted.

On an outer surface of the substrate 9 (a surface opposite to a surfacefacing the transparent conductive film 5), the polarizing film (apolarizing plate, a polarizing film) 7A is arranged. Similarly, on anouter surface of the substrate 10 (a surface opposite to a surfacefacing the transparent conductive film 6), the polarizing film (apolarizing plate, a polarizing film) 8A is arranged.

The material of the polarizing films 7A and 8A may include, for example,polyvinylalcohol (PVA). Further, as the polarizing film, a material withiodine doped into the above-mentioned material may be used.

As the polarizing film, a film, for example, made of the above-mentionedmaterial and extended in one axis direction may be used.

By arranging such polarizing films 7A and 8A, it is possible to moreeffectively control light transmittance by adjusting the amount of theelectrical conduction.

The directions of the polarizing axes of the polarizing films 7A and 8Aare normally determined by the alignment directions of the inorganicalignment films 3A and 4A.

Next, an example of a method of forming an inorganic alignment filmaccording to the present will be described.

The method of forming an inorganic alignment film according to thepresent comprises a milling step and a film-forming step as describedbelow.

Hereinafter, only a case of forming the inorganic alignment film 3A onthe base substrate 100 will be described, but the inorganic alignmentfilm 4A can also be formed similarly.

Milling Step

In the present step, a plurality of concave portions having apredetermined directivity is formed on the base substrate (thetransparent conductive film).

FIG. 4 is a schematic view of a milling device which is used to form theconcave portions on the base substrate.

The milling device M100 shown in FIG. 4 has an ion source M1, a vacuumchamber M2, a base substrate holder M3 for fixing the base substrate inthe vacuum chamber M2, and an air pump M4 for controlling a pressurewithin the vacuum chamber M2.

The ion source M1 has a filament M11 therein, and a leading-outelectrode M12. Further, the ion source M1 is connected to a gas supplysource M13 for supplying gas into the ion source M1.

A case of forming the concave portions 51 on the base substrate 100using such a milling device will now be schematically described.

1. In the base substrate holder M3, the base substrate 100 is providedsuch that the substrate 9 contacts the base substrate holder M3.

2. A pressure within the vacuum chamber M2 is reduced by theair-discharging pump M4.

3. Gas is supplied from the gas supply source M13 into the ion sourceM1.

4. A voltage is applied to the filament M11 from a power source (notshown), such that hot electrons are generated.

5. The generated hot electrons collide against introduced gas, and thegas is ionized, such that plasmas (ions) are generated.

6. An acceleration voltage of ions is applied to the leading-outelectrode M12, and the ions are accelerated, such that ion beams areirradiated toward the base substrate 100.

7. The irradiated ion beams collide against the base substrate 100 (thetransparent conductive film 5) from a direction inclined at an angle ofθ_(b) with respect to a direction orthogonal to a surface of the basesubstrate 100 on which the inorganic alignment film 3A is formed.

8. At portions on the base substrate 100 (transparent conductive film 5)onto which the ion beams are irradiated, the concave portions 51 areformed.

Moreover, the base substrate holder M3 is moved or rotated in advancesuch that the ion beams irradiated from the ion source M1 collideagainst the surface of the base substrate 100, on which the inorganicalignment film 3A is formed, from a direction inclined at apredetermined angle (a collision angle) θ_(b) with respect to adirection orthogonal to the surface. Alternatively, the base substrateholder M3 may be moved or rotated by the collision angle θ_(b) while theion beams are irradiated.

In such a method of forming an inorganic alignment film according to thepresent invention, in the milling step, the ion beams are irradiatedonto the surface of the base substrate, on which the inorganic alignmentfilm is formed, from a direction inclined at the predetermined angle(the collision angle) θ_(b) with respect to the direction orthogonal tothe surface. Thus, it is possible to more efficiently form the concaveportions having a predetermined directivity as described above. As aresult, it is possible to allow the suitable pretilt angle to beexpressed.

The collision angle θ_(b) is not specifically limited, but is preferably2° or more, and more preferably, 2 to 100. Thus, the above-mentionedeffects become more remarkable. To the contrary, if the collision angleθ_(b) is too small, it may be difficult to arrange directivity of theconcave portions 51 to be formed in order. Meanwhile, if the collisionangle θ_(b) is too large, efficiency for forming the concave portions 51may be lowered, and further it may be difficult to sufficiently increasethe alignment property of the resultant inorganic alignment film 3A.Furthermore, it may be difficult to make a relatively large pretiltangle.

In the present step, the current of the ion beams to be irradiated ispreferably 100 to 1000 mA, and more preferably, 500 to 800 mA. Thus, itis possible to more efficiently form a plurality of concave portions 51at random positions on the base substrate 100. As a result, it ispossible to improve regulation ability of the inorganic alignment film3A to the alignment properties of the liquid crystal molecules. To thecontrary, if the ion beam current is less than the above-mentioned upperlimit value, it may be difficult to sufficiently form the plurality ofconcave portions 51 according to an acceleration voltage or anirradiation time of the ion beams. Further, if the ion beam currentexceeds the above-mentioned upper limit value, adjacent concave portions51 may be joined together according to the acceleration voltage or theirradiation time of the ion beams. As a result, it is likely that theregulation ability on the alignment properties of the liquid crystalmolecules may be lowered.

The acceleration voltage of the ion beams is preferably 400 to 1400 V,and more preferably, 600 to 1000 V. Thus, it is possible to moreefficiently form the concave portions 51 each having a suitable inclinedsurface. To the contrary, if the acceleration voltage is less than theabove-mentioned lower limit value, concave portions 51 may not have asufficient size. Further, if the acceleration voltage exceeds theabove-mentioned upper limit value, it may be difficult to control theshapes of the concave portions 51.

A pressure within the vacuum chamber M2, that is, the pressure of anatmosphere in the vicinity of the base substrate 100 in the present stepis preferably 5.0×10⁻¹ Pa or less, and more preferably, 5.0×10⁻² Pa orless. Thus, it is possible to improve the rectilinearity of the ionbeams, and further it is possible to more efficiently form the concaveportions 51; each having an inclined surface of a suitable angle. To thecontrary, if the pressure of the atmosphere exceeds the above-mentionedupper limit value, the rectilinearity of the ion beams may be lowered.Further, it may be difficult to control the shapes of the concaveportions 51 to be formed.

In the above description, only a case of forming the concave portions 51in the base substrate 100 is described, but the concave portions 61 canalso be formed similarly.

Film-Forming Step

Next, as described above, on the base substrate 100 (the transparentconductive film 5) in which a plurality of concave portions 51 isformed, an inorganic alignment film 3A is formed.

A method for forming the inorganic alignment film 3A on the basesubstrate 100 is not specifically limited, but any one of a sputteringmethod (for example, a magnetron sputtering method, an ion beamsputtering method, or the like), a vapor deposition method, a sol-gelmethod, a self-organizing method and so on may be used. Among them, itis particularly preferable to use the sputtering method. Thus, it ispossible to more efficiently form the inorganic alignment film 3A.

Hereinafter, a case in which the ion beam sputtering method isrepresentatively used will be described.

FIG. 5 is a schematic of an ion beam sputter device for forming theinorganic alignment film.

The ion beam sputter device S100 shown in FIG. 5 has an ion source S1for irradiating ion beams, a target S2 for generating (irradiating)sputter particles by the irradiation of the ion beams, a vacuum chamberS3, an air pump S4 for controlling a pressure within the vacuum chamberS3, and a base substrate holder S5 for fixing the base substrate withthe inorganic alignment film formed thereon in the vacuum chamber S3.

The ion source S1 has a filament S11 therein, and a leading-outelectrode S12. Further, to the ion source S1, a gas supply source S13for supplying gas into the ion source S1 is connected.

A case in which the inorganic alignment film 3A is formed using the ionbeam sputter device shown in FIG. 5 will now be schematically described.

1. The base substrate 100 is provided in the base substrate holder S5 inthe vacuum chamber S3.

2. A pressure within the vacuum chamber S3 is reduced by theair-discharging pump S4.

3. Gas is supplied from the gas supply source S13 into the ion sourceS1.

4. A voltage is applied to the filament S11 from a power source (notshown), such that hot electrons are generated.

5. The generated hot electrons collide against introduced gas, and thegas is ionized, such that plasmas (ions) are generated.

6. An acceleration voltage of ions is applied to the leading-outelectrode S12, and the ions are accelerated and irradiated onto thetarget S2 as the ion beams.

7. The target S2 on which the ion beams are irradiated illuminatessputter particles toward the base substrate 100, such that a substrate(a substrate for electronic device according to the present invention (asubstrate for electronic device 200)) in which the inorganic alignmentfilm 3A is formed on the base substrate 100 is obtained.

A pressure within the vacuum chamber S3, that is, the pressure of anatmosphere when the inorganic alignment film 3A is formed is preferably10⁻² Pa or less. Thus, it is possible to more efficiently form theinorganic alignment film 3A. If the pressure within the vacuum chamberS3 is too high, it is likely to cause the rectilinearity of theirradiated sputter particles to be lowered. As a result, a uniform filmmay not be formed.

An ion acceleration voltage to be applied to the leading-out electrodeS12 is not specifically limited, but it is preferably 600 to 1400 V, andmore preferably 800 to 1400 V. Thus, it is possible to more efficientlyform the inorganic alignment film 3A. To the contrary, if theacceleration voltage of ions is less than the above-mentioned lowerlimit value, a sputter rate may be lowered, and sufficient productivitymay not be obtained. Meanwhile, if the acceleration voltage exceeds theabove-mentioned upper limit value, it tends to generate a variation inthe alignment properties of the liquid crystal molecules.

When forming the inorganic alignment film 3A, a temperature of the basesubstrate 100 is preferably relatively low. More specifically, atemperature of the base substrate 100 is preferably 150° C. or less,more preferably 100° C. or less, and still further preferably 80 to 50°C. Thus, it is possible to suppress a phenomenon that the sputterparticles attached to the base substrate 100 move from their originallyattached positions, that is, migrations, and thus it is possible tofurther improve a regulation ability of the inorganic alignment film 3Ato the alignment properties of the liquid crystal molecules. Moreover,if necessary, the base substrate 100 may be cooled such that thetemperature of the base substrate 100 at the time of the formation ofthe inorganic alignment film 3A falls within the above-mentioned range.

Gas to be supplied from the gas supply source S13 into the ion source S1is not specifically limited except for a noble gas, but, among them, itis particularly preferable to use argon gas. Thus, it is possible toimprove a forming speed (a sputter rate) of the inorganic alignment film3A.

The material constituting the target S2 is suitably selected accordingto the material for forming the inorganic alignment film 3A. Forexample, in the case in which the inorganic alignment film made of SiO₂is formed, a target S2 made of SiO₂ may be used, and in the case inwhich the inorganic alignment film made of SiO, a target S2 made of SiO₂may be used.

Moreover, in the present embodiment, a case in which the sputterparticles are irradiated in a direction substantially orthogonal to thebase substrate 100 is described, but the sputter particles may beirradiated from an inclined direction. If the sputter particles areirradiated from the inclined direction, it is possible to design anadditional improvement of the alignment properties of the liquid crystalmolecules, and further it is possible to allow the suitable pretiltangle to be expressed.

Further, in the above-mentioned embodiment, a method of forming theconcave portions by irradiating the ion beams onto the transparentconductive film 5 is described, but the concave portions may be formedon the substrate 9 by irradiating the ion beams onto the substrate 9prior to forming the transparent conductive film 5.

Further, after forming the inorganic alignment film 3A, the ion beamsmay be additionally irradiated onto the inorganic alignment film 3A.Thus, it is possible to make the surface of the inorganic alignment film3A in a shape with which the liquid crystal molecules is aligned moreeasily.

As described above, a case of forming the inorganic alignment film 3A isdescribed, but the inorganic alignment film 4A can also be formedsimilarly.

Next, a second embodiment of a liquid crystal panel according to thepresent invention will be described.

FIG. 6 is a schematic longitudinal cross-sectional view showing a secondembodiment of a liquid crystal panel according to the present invention.Hereinafter, as regards the liquid crystal panel 1B shown in FIG. 6,differences from the first embodiment will be described, and thedescriptions of elements common to the first embodiment will be omitted.

As shown in FIG. 6, the liquid crystal panel (a TFT liquid crystalpanel) 1B has a TFT substrate (a liquid crystal driving substrate) 17,an inorganic alignment film 3B bonded to the TFT substrate 17, a countersubstrate 12 for a liquid crystal panel, an inorganic alignment film 4Bbonded to the counter substrate 12 for a liquid crystal panel, a liquidcrystal layer 2 made of liquid crystal which is filled into a spacebetween the inorganic alignment film 3B and the inorganic alignment film4B, a polarizing film 7B bonded to an outer surface of the TFT substrate(the liquid crystal driving substrate) 17 (a surface opposite to asurface facing the inorganic alignment film 4B), and a polarizing film8B bonded to an outer surface of the counter substrate 12 for a liquidcrystal panel (a surface opposite to a surface facing the inorganicalignment film 4B). The inorganic alignment films 3B and 4B are formedby the same forming method (the method of forming an inorganic alignmentfilm according to the present invention) as that of the inorganicalignment films 3A and 4A in the above-mentioned first embodiment, andthe polarizing films 7B and 8B are the same as the polarizing films 7Aand 8A described in the first embodiment.

The counter substrate 12 for a liquid crystal panel has a microlenssubstrate 11, a black matrix 13 provided on an outer layer 114 of themicrolens substrate 11, in which openings 131 are formed, and atransparent conductive film (a common electrode) 14 provided to coverthe black matrix 13 on the outer layer 114.

The microlens substrate 11 has a concave portion including substrate 111for a microlens (a first substrate) provided with plural (numerous)concave portions (concave portions for the microlenses) 112 each havinga concave surface, and the outer layer (a second substrate) 114 bondedto a surface, on which the concave portions 112 of the substrate 111,via a resin layer (an adhesive layer) 115. Further, in the resin layer115, microlenses 113 are formed by a resin filled into the concaveportions 112.

The substrate 111 is made from a flat plate-shaped main material (atransparent substrate), and plural (numerous) concave portions 112 areformed in its surface. The concave portions 112 can be formed, forexample, by a dry etching method, a wet etching method or the like usinga mask.

The substrate 111 is made of, for example, glass.

A thermal expansion coefficient of the main material is preferablyapproximately equal to the thermal expansion coefficient of a glasssubstrate 171 (for example, a ratio of the thermal expansioncoefficients is about 0.1 to 10). Thus, it is possible to preventcurving, bending, detachment or the like due to a difference of thethermal expansion coefficients when a temperature is changed in theresulting liquid crystal panel.

From this point of view, the substrate 111 and the glass substrate 171are preferably made of the same material. Thus, it is possible toeffectively prevent the curving, bending, detachment or the like due tothe difference of the thermal expansion coefficients during the changeof temperature.

In particular, in the case in which the microlens substrate 11 is usedfor the TFT liquid crystal panel of high temperature polysilicon, thesubstrate 111 is preferably made of quartz glass. The TFT liquid crystalpanel has the TFT substrate as the liquid crystal driving substrate. Assuch a TFT substrate, quartz glass having a property which is minimallychanged by a manufacturing environment is preferably used. For thisreason, in correspondence with the TFT substrate, the substrate 111 isalso made of quartz glass, such that it is possible to obtain the TFTliquid crystal panel in which the curving, bending or the like isunlikely and which has excellent stability.

On the upper surface of the substrate 111, a resin layer (an adhesivelayer) 115 is provided to cover the concave portions 112.

By filling the material of the resin layer 115, the microlenses 113 areformed in the concave portions 112.

The resin layer 115 may be made of, for example, resin (adhesive) havinga refractive index higher than the refractive index of the material ofthe substrate 111. For example, the resin layer 115 may be suitably madeof an ultraviolet curable resin such as an acrylic resin, an epoxyresin, an acrylic epoxy resin.

On the upper surface of the resin layer 115, the flat plate-shape outerlayer 114 is provided. The outer layer (a glass layer) 114 may be madeof, for example, glass. In this case, the thermal expansion coefficientof the outer layer 114 is preferably approximately equal to the thermalexpansion coefficient of the concave portion formed substrate 111 formicrolens. For example, a ratio of the thermal expansion coefficients ispreferably about 0.1 to 10. Thus, it is possible to prevent the curving,bending or the like due to the difference of the thermal expansioncoefficients of the substrate 111 and the outer layer 114. Such aneffect can be more effectively obtained by making the substrate 111 andthe outer layer 114 with the same material.

From a point of view for obtaining necessary optical properties when themicrolens substrate 11 is used for the liquid crystal panel, thethickness of the outer layer 114 is normally about 5 to 1000 μm, andmore preferably, 10 to 150 μm.

Moreover, the outer layer (a barrier layer) 114 may be made of, forexample, ceramics. Moreover, as such ceramics, for example,nitride-based ceramics containing AlN, SiN, TiN and BN, oxide-basedceramics containing Al₂O₃ and TiO₂, and carbide-based ceramicscontaining WC, TiC, ZrC, TaC may be included. When the outer layer 114is made of ceramics, the thickness of the outer layer 114 is notspecifically limited, but it is preferably 20 nm to 20 μm, and morepreferably, 40 nm to 1 μm.

In addition, if necessary, the outer layer 114 may be omitted.

The black matrix 13 has a light-shielding function and is made of, forexample, a metallic material such Cr, Al, Al alloy, Ni, Zn, Ti and soon, or a resin in which carbon or titanium is distributed.

The transparent conductive film 14 has a conductive property and is madeof, for example, indium tin oxide (ITO), indium oxide (IO), tin oxide(SnO₂).

The TFT substrate 17 is a substrate for driving the liquid crystal ofthe liquid crystal layer 2, and comprises a glass substrate 171, plural(numerous) pixel electrodes 172 provided on the glass substrate 171 andarranged in a matrix, and plural (numerous) thin film transistors (TFTs)173 corresponding to the respective pixel electrode 172. In FIG. 6, asealing material, wiring lines, and so on are omitted.

The glass substrate 171 is preferably made of quartz glass for theabove-mentioned reason.

The pixel electrode 172 drives the liquid crystal of the liquid crystallayer 2 by charging and discharging between the transparent conductivefilm (the common electrode) 14 and the pixel electrode 172. The pixelelectrode 172 is made of, for example, the same material as that of theabove-mentioned transparent conductive film 14.

The thin film transistor 173 is connected to the nearby correspondingpixel electrode 172. Further, the thin film transistor 173 is connectedto a control circuit which is not shown, and controls the current to besupplied to the pixel electrode 172. Thus, the charging and dischargingof the pixel electrode 172 is controlled.

The inorganic alignment film 3B is bonded to the pixel electrodes 172 ofthe TFT substrate 17, and the inorganic alignment film 4B is bonded tothe transparent conductive film 14 of the counter substrate 12 for a theliquid crystal panel.

The liquid crystal layer 2 contains the liquid crystal molecules, andcorresponding to the charging and discharging of the pixel electrode172, the alignment of such liquid crystal molecules, that is, the liquidcrystal changes.

In such a liquid crystal panel 1B, one pixel normally comprises onemicrolens 113, one opening 131 of the black matrix 13 corresponding toan optical axis Q of the microlens 113, one pixel electrode 172, and onethin film transistor 173 connected to the pixel electrode 172.

An incident light L from the counter substrate 12 for a liquid crystalpanel passes through the substrate 111, is condensed while passingthrough the microlens 113, and transmits the resin layer 115, the outerlayer 114, the opening 131 of the black matrix 13, the transparentconductive film 14, the liquid crystal layer 2, the pixel electrode 172,and the glass substrate 171. At this time, since the polarizing film 8Bis provided at the incident side of the microlens substrate 11, theincident light L is linearly polarized when transmitting the liquidcrystal layer 2. In this case, the polarizing direction of the incidentlight L is controlled corresponding to the alignment state of the liquidcrystal molecules of the liquid crystal layer 2. Therefore, by allowingthe incident light L transmitted the liquid crystal panel 1B to transmitthe polarizing film 7B, it is possible to control the brightness ofemitting light.

As described above, the liquid crystal panel 1B has the microlens 113,and additionally the incident light L passed through the microlens 113is condensed and passes through the opening 131 of the black matrix 13.Meanwhile, in portions of the black matrix 13 at which the openings 131are not formed the incident light L is shielded. Therefore, in theliquid crystal panel 1B, leaking of unnecessary light from portionsother than the pixels is prevented, and the attenuation of the incidentlight L in the pixel portions is suppressed. For this reason, the liquidcrystal panel 1B has high transmittance in the pixel portions.

The liquid crystal panel 1B can be manufactured, for example, by formingthe inorganic alignment films 3B and 4B on the TFT substrate 17 and thecounter substrate 12 for a liquid crystal panel (manufactured with aknown method), respectively, joining both substrates via a sealingmaterial (not shown), injecting liquid crystal from a filling hole (notshown) into a space defined both substrates, and then closing up thefilling hole.

Moreover, in the above-mentioned liquid crystal panel 1B, the TFTsubstrate is used as the liquid crystal driving substrate, but liquidcrystal driving substrates other than the TFT substrate, for example, aTFD substrate, an STN substrate or the like may be used for the liquidcrystal driving substrate.

The liquid crystal panel comprising the above-mentioned inorganicalignment film can be suitably used for devices having an intensivelight source or to be used outdoors.

Next, an electronic apparatus (a liquid crystal display device)comprising the above-mentioned liquid crystal panel 1A will be describedin detail with reference to FIGS. 7 to 9.

FIG. 7 is a perspective view showing a construction of a portable(notebook) personal computer to which an electronic apparatus accordingto the present invention is applied.

In FIG. 7, a personal computer 1100 comprises a main body portion 1104provided with a keyboard 1102, and a display unit 1106. The display unit1106 is rotatably supported via a hinge structure with respect to themain body portion 1104.

In the personal computer 1100, the display unit 1106 comprises theabove-mentioned liquid crystal panel 1A, and a backlight which is notshown. An image (information) can be displayed by allowing light fromthe backlight to transmit the liquid crystal panel 1A.

FIG. 8 is a perspective view showing a construction of a cellular phone(also including a PHS) to which an electronic apparatus according to thepresent invention is applied.

In FIG. 8, the cellular phone 1200 comprises a plurality of operatingbuttons 1202, a receiver 1204 and a transmitter 1206. In addition, thecellular phone 1200 comprises the above-mentioned liquid crystal panel1A and a backlight which is not shown.

FIG. 9 is a perspective view showing a construction of a digital stillcamera to which an electronic apparatus according to the presentinvention is applied. Moreover, in FIG. 9, connections of the digitalstill camera with exterior apparatuses are simply shown.

Here, a typical camera exposes a photographic film by the optical imageof a subject for photography, while the digital still camera 1300photoelectrically converts the optical image of the subject forphotography using an image pickup element such as a CCD (a chargecoupled device) and generates an image pickup signal (image signal).

In the digital still camera 1300, the above-mentioned liquid crystalpanel 1A and a backlight (not shown) are provided on the rear surface ofa case (a body) 1302, such that a display is preformed based on theimage pickup signal by the CCD. The liquid crystal panel 1A functions asa finder for displaying the subject for photography as an electronicimage.

Inside the case, a circuit board 1308 is arranged. On the circuit board1308, a memory for storing (memorizing) the image pickup signal isarranged.

Further, on a front surface of the case 1302 (a rear surface in theshown construction), a light receiving unit 1304 including an opticallens (an image pickup optical system) or the CCD is provided.

If a photographer confirms an image of the subject for photographydisplayed on the liquid crystal panel 1A and presses a shutter button1306, the image pickup signal of the CCD at that point of time istransferred and stored to the memory of circuit board 1308.

Further, in the digital still camera 1300, a video signal outputterminal 1312 and an input/output terminal 1314 for data communicationare provided on a side surface of the case 1302.

As shown in FIG. 9, as occasion demands, a television monitor 1430 isconnected to the video signal output terminal 1312, and a personalcomputer 1440 is connected to the input/output terminal 1314 for datacommunication, respectively. In addition, by a predetermined operation,the image pickup signal stored in the memory of the circuit board 1308is outputted to the television monitor 1430 or the personal computer1440.

Next, as an example of an electronic apparatus according to the presentinvention, an electronic apparatus (a liquid crystal projector) usingthe above-mentioned liquid crystal panel 1B will be described.

FIG. 10 is a view schematically showing an optical system of anelectronic apparatus (a projection display device) according to thepresent invention.

As shown in FIG. 10, a projection display device 300 comprises a lightsource 301, an irradiating optical system provided with a plurality ofintegrator lenses, a color separating optical system (a light guidingoptical system) provided with a plurality of dichroic mirrors and so on,a (red) liquid crystal light valve (a liquid crystal light shutterarray) 24 corresponding to red, a (green) liquid crystal light valve (aliquid crystal light shutter array) 25 corresponding to green, a (blue)liquid crystal light valve (a liquid crystal light shutter array) 26corresponding to blue, a dichroic prism (a color synthesizing opticalsystem) 21 on which a dichroic mirror surface 211 reflecting only redlight component and a dichroic mirror surface 212 reflecting only bluelight component, and a projective lens (a projecting optical system) 22.

Further, the irradiating optical system has integrator lenses 302 and303. The color separating optical system has mirrors 304, 306 and 309, adichroic mirror 305 for reflecting blue light component and green lightcomponent (transmitting only red light component), a dichroic mirror 307for reflecting the green light component, a dichroic mirror 308 forreflecting only the blue light component (or a mirror reflecting theblue light component), and condensing lenses 310, 311, 312, 313 and 314.

The liquid crystal light valve 25 is provided with the above-mentionedliquid crystal panel 1B. The liquid crystal light valves 24 and 26 havethe same construction as the liquid crystal light valve 25. The liquidcrystal panels 1B comprised in the respective liquid crystal lightvalves 24, 25 and 26 are respectively connected to driving circuitswhich are not shown.

Moreover, in the projection display device 300, an optical block 20 iscomprised of the dichroic prism 21 and the projective lens 22. Further,a display unit 23 is comprised of the optical block 20, and the liquidcrystal light valves 24, 25 and 26 fixedly arranged to the dichroicprism 21.

Hereinafter, an action of the projection display device 300 will bedescribed.

A white light component (a white light flux) emitted from the lightsource 301 transmits the integrator lenses 302 and 303. An opticalintensity of the white light component (a brightness distribution) isequalized by the integrator lenses 302 and 303. The white light emittedfrom the light source 301 preferably has a relatively high opticalintensity. Thus, it is possible to make an image to be formed on ascreen 320 more bright. Further, since the liquid crystal panel 1Bhaving excellent light resistance is used in the projection displaydevice 300, it is possible to maintain stability for a long time evenwhen the light emitted from the light source 301 has a high intensity.

The white light components transmitted the integrator lenses 302 and 303are reflected to a left side of FIG. 10 in the mirror 304. Among thereflected light components, the blue light component (B) and the greenlight component (G) are respectively reflected to a lower side of FIG.10 in the dichroic mirror 305, and the red light component (R) transmitsthe dichroic mirror 305.

The red light component having transmitted the dichroic mirror 305 isreflected to a lower side of FIG. 10 in the mirror 306, and thereflected light is shaped by the condensing lens 310 and incident to thered liquid crystal light valve 24.

Between the blue light component and the green light component reflectedin the dichroic mirror 305, the green light component is reflected to aleft side of FIG. 10 in the dichroic mirror 307, and the blue lightcomponent transmits the dichroic mirror 307.

The green light component reflected in the dichroic mirror 307 is shapedby the condensing lens 311 and incident to the green liquid crystallight valve 25.

Further, the blue light component transmitted the dichroic mirror 307 isreflected to a left side of FIG. 10 in the dichroic mirror (or mirror)308, and then the reflected light is reflected to an upper side of FIG.10 in the mirror 309. The blue light component is shaped by thecondensing lenses 312, 313 and 314 and incident to the blue liquidcrystal light valve 26.

As described above, the white light component emitted from the lightsource 301 is separated into three primary colors of red, green and blueby the color separating optical system, and the respective separatedlight components are guided and incident to the corresponding liquidcrystal light valve.

At this time, the respective pixels (the thin film transistors 173 andthe pixel electrodes 172 connected thereto) of the liquid crystal panel1B comprised in the liquid crystal light valve 24 are switchablycontrolled (on/off) by the driving circuit (driving means) whichoperates based on the red image signal, that is, modulated.

Similarly, the green light component and the blue light component arerespectively incident to the liquid crystal light valves 25 and 26, andmodulated in the respective liquid crystal panels 1B, such that thegreen image and the blue image are respectively formed. At this time,the respective pixels of the liquid crystal panel 1B comprised in theliquid crystal light valve 25 are switchably controlled by the drivingcircuit which operates based on the green image signal, and therespective pixels of the liquid crystal panel 1B comprised in the liquidcrystal light valve 26 are switchably controlled by the driving circuitwhich operates based on the blue image signal.

Thus, the red light component, the green light component and the bluelight component are respectively modulated in the liquid crystal lightvalves 24, 25 and 26, such that the red image, the green image and theblue image are respectively formed.

The red image formed by the above-mentioned liquid crystal light valve24, that is, the red light component from the light crystal light valve24 is incident to the dichroic prism 21 from a surface 213, is reflectedto a left side of FIG. 10 in the dichroic mirror surface 211, transmitsthe dichroic mirror surface 212, and is emitted from the emittingsurface 216.

Further, the green image formed by the above-mentioned liquid crystallight valve 25, that is, the green light component from the liquidcrystal light valve 25 is incident to the dichroic prism 21 from asurface 214, transmits the dichroic mirror surfaces 211 and 212respectively, and is emitted from the emitting surface 216.

Further, the blue image formed by the above-mentioned liquid crystallight valve 26, that is, the blue light component from the liquidcrystal light valve 26 is incident to the dichroic prism 21 from asurface 215, is reflected to a left side of FIG. 10 in the dichroicmirror surface 212, transmits the dichroic mirror surface 211, and isemitted from the emitting surface 216.

As described above, the respective color light components from theabove-mentioned liquid crystal light valves 24, 25 and 26, that is, therespective images formed by the liquid crystal light valves 24, 25 and26 are synthesized by the dichroic prism 21, such that a color image isformed. The image is projected (magnified and projected) on the screen320 arranged at a predetermined position by the projective lens 22.

Moreover, an electronic apparatus according to the present invention mayinclude electronic apparatuses other than the personal computer (theportable personal computer) of FIG. 7, the cellular phone of FIG. 8, thedigital still camera of FIG. 9 and the projection display device of FIG.10. For example, a television, a video camera, a view finder type ormonitor-direct-view type video tape recorder, a car navigation device, apager, an electronic organizer (including one with a communicationfunction), an electronic dictionary, an electronic calculator, anelectronic game machine, a word processor, a video phone, a televisionmonitor for security, electronic binoculars, a workstation, a POSterminal, an apparatus with a touch panel (for example, cash dispenserof a financial organization, an automated ticket vending machine), amedical apparatus (for example, an electronic thermometer, asphygmomanometer, a blood sugar meter, an electrocardiogram displaydevice, an ultrasonic diagnosis apparatus, an endoscopic displaydevice), a fish finder, various measurement instruments, meters (forexample, meters of a vehicle, an aircraft or a vessel), a flightsimulator may be included. It is needless to say that theabove-mentioned liquid crystal panel according to the present inventioncan be applied as a display unit or a monitor unit of these electronicapparatuses.

As described above, the inorganic alignment film, the substrate forelectronic device, the liquid crystal panel, the electronic apparatusand the method of forming the inorganic alignment film are describedbased on the embodiments shown in the drawings, but the presentinvention is not limited to the embodiments.

For example, in the method of forming the inorganic alignment filmaccording to the present invention, one or more processes for anoptional purpose may be added. Further, in the substrate for electronicdevice, the liquid crystal panel and the electronic apparatus, eachelement may be substituted with an optional element exhibiting the samefunction. In addition, an optional element may be added.

Further, in the above-mentioned embodiments, a case of forming a film byapplying the ion beam sputtering method is described, but a magnetronsputtering method, a long range sputtering method in which a distancebetween a target and a base substrate is relatively long or the like maybe applied.

Further, in the above-mentioned embodiments, the projection displaydevice (the electronic apparatus) having three liquid crystal panels towhich the liquid crystal panel according to the present invention (aliquid crystal panel of which the inorganic alignment film contains anoptical stabilization agent) is applied is described. However,alternatively, less than three panels may be made of the liquid crystalpanel according to the present invention. In this case, the presentinvention is preferably applied to at least the blue liquid crystalpanel.

EXAMPLES

Manufacture of Liquid Crystal Panel

As described below, the liquid crystal panel is manufactured as shown inFIG. 6.

Example 1

First, as described below, the microlens substrate is manufactured.

A non-processed quartz glass substrate (a transparent substrate) havinga thickness of 1.2 mm is prepared as a parent material. Then, by dippingthe substrate into a cleaning solvent (a mixture solution of sulphuricacid and oxygenated water) of 85° C., a cleaning process for cleaningthe surface of the substrate is performed.

Subsequently, on the front and rear surfaces of the quartz glasssubstrate, a film of polycrystalline silicon having a thickness of 0.4μm is formed by the CVD method.

Subsequently, in the formed polycrystalline silicon film, openingscorresponding to the concave portions to be formed are formed.

This is preformed as follows. First, a resist layer having a pattern ofthe concave portions to be formed is formed on the polycrystallinesilicon. Next, a dry etching by a CF gas is performed to thepolycrystalline silicon to form the openings. Next, the resist layer isremoved.

Next, a wet etching (at etching temperature of 30° C.) is performed bydipping the quartz glass substrate into an etching solution (a mixtureaqueous solution of 10 percent by weight of fluoric acid and 10 percentby weight of glycerin for 120 minutes, such that the concave portionsare formed on the quartz glass substrate.

Subsequently, by dipping the quartz glass substrate into 15 percent byweight of tetramethyl ammonium hydroxide aqueous solution for fiveminutes, the polycrystalline silicon film formed on the front and rearsurfaces is removed, such that the concave portion including substratefor the microlens is obtained.

Next, on a surface of the concave portion including substrate on whichthe concave portions are formed, an ultraviolet (UV) curable acrylicoptical adhesive (a refractive index of 1.60) is coated with no bubble.Subsequently, a cover glass (an outer layer) of quartz glass is bondedto the optical adhesive, and then the optical adhesive is cured by anirradiation of ultraviolet rays, such that a laminated structure isobtained.

Subsequently, by removing and polishing the cover glass to a thicknessof 50 μm, the microlens substrate is obtained.

Moreover, in the obtained microlens substrate, the thickness of theresin layer is 12 μm.

To the obtained microlens substrate, the light-shielding film (Cr film)having a thickness of 0.16 μm, that is, a black matrix is formed usingthe sputtering method and the photolithography method, thelight-shielding layer being provided with openings at positionscorresponding to the microlenses of the cover glass. In addition, theITO film (the transparent conductive film) having a thickness of 0.15 μmis formed on the black matrix by the sputtering method, such that thecounter substrate (the base substrate) for liquid crystal panel ismanufactured.

Milling Process

On the surface of the transparent conductive film of the obtainedcounter substrate for liquid crystal panel, the concave portions areformed using the milling device M100 shown in FIG. 4 as described below.

First, in the base substrate holder M3 within the vacuum chamber M2, thecounter substrate for the liquid crystal panel is provided, and thepressure within the vacuum chamber M2 is reduced to 1×10⁻⁴ Pa using theair-discharging pump M4.

Next, argon gas is injected into the ion source M1 by the gas supplysource M13, such that plasmas are generated. Then, an ion accelerationvoltage of 800 V is applied to the leading-out electrode M12, and ionsare accelerated, such that ions are irradiated onto the countersubstrate for liquid crystal panel as ion beams. Moreover, a collisionangle of the ion beams against the counter substrate for liquid crystalpanel is 3°.

Moreover, the inclination angle θ_(d) of each of the inclined surfacesof the concave portions formed on the counter substrate for a liquidcrystal panel is 3 to 5°. In addition, the average width W₁ of theconcave portion in an inclination direction of the inclined surface ofthe concave portion is 10 nm, and the average width W₂ of the concaveportion in a direction orthogonal to the inclination direction is 10 nm.Further, an ion beam current is 500 mA.

Film-Forming Process

On the transparent conductive film of the counter substrate for liquidcrystal panel, on which a plurality of concave portions is formed,obtained in such a manner, an inorganic alignment film is formed usingthe device shown in FIG. 5 as described below.

First, the counter substrate for the liquid crystal panel is provided inthe base substrate holder S5 within the vacuum chamber S3, and thepressure of the vacuum chamber S3 is reduced to 5.0×10⁻³ Pa by the airpump S4.

Next, argon gas is supplied from the gas supply source S13 into the ionsource S1, such that plasmas are generated. Then, an ion accelerationvoltage of 200 V is applied to the leading-out electrode S12, and theions are accelerated, such that the ions are irradiated onto the targetS2 as the ion beams. Moreover, as the target S2, SiO₂ is used.

When the ion beams is irradiated, the target S2 irradiated sputterparticles toward the counter substrate for liquid crystal panel, suchthat the inorganic alignment film made of SiO₂ having an averagethickness of 0.05 μm is formed on the transparent conductive film.Moreover, an irradiation angle θ_(S) of the sputter particles is 3.5°.Further, when forming the film, a temperature of the counter substratefor liquid crystal panel is 80° C.

Further, on the surface of the TFT substrate (the quartz glass)separately prepared, an inorganic alignment film is also formedsimilarly to the above-mentioned method.

The counter substrate for the liquid crystal device with the inorganicalignment film formed thereon and the TFT substrate with the inorganicalignment film formed thereon are joined via the sealing material. Thisjoining is performed such that the alignment direction of the inorganicalignment films is tilted 90° to allow the liquid crystal moleculesconstituting the liquid crystal layer to be left twisted.

Next, liquid crystal (MJ99247 of Merk & Co.) is injected into a spacedefined between the inorganic alignment film and the inorganic alignmentfilm from a filling hole, and then the filling hole is closed. Thethickness of the formed liquid crystal layer is about 3 μm.

Subsequently, to the outer surface of the counter substrate for liquidcrystal panel and the outer surface of the TFT substrate, the polarizingfilm 8B and the polarizing film 7B are bonded respectively, such thatthe TFT liquid crystal panel having a structure shown in FIG. 4 ismanufactured. As the polarizing film, a film made of polyvinylalcohol(PVA) and extended in one axis direction is used. Moreover, the joiningdirection of the polarizing film 7B and the polarizing film 8B isdetermined based on the alignment direction of the inorganic alignmentfilm 3B and the inorganic alignment film 4B. That is, the polarizingfilm 7B and the polarizing film 8B are bonded such that incident lightis transmitted when a no voltage is applied and is not transmitted whena voltage is applied.

Moreover, the pretilt angle of the manufactured liquid crystal panel isin a range of 3 to 7°.

Examples 2 and 3

Except that the inorganic alignment film made of SiO₂ is formed underconditions in the respective milling step as shown in Table 1, theliquid crystal panel is manufactured similarly to Example 1.

Examples 4 to 6

Except that SiO₂ is used as the target S2 and the inorganic alignmentfilm made of SiO is formed under conditions in the respective millingstep as shown in Table 1, the liquid crystal panel is manufacturedsimilarly to Example 1.

Comparative Example 1

A solution (AL6256 of JSR (Japanese Synthetic Rubber) corporation) ofpolyimide-based resin (PI) is prepared, and a film having an averagethickness of 0.03 μm is formed on the counter substrate for liquidcrystal panel by a spic coat method, without using the device as shownin FIG. 5. Then, a rubbing process is performed on the film such thatthe pretilt angle is 2 to 3°, thereby forming an alignment film. Exceptthat, similarly to the above-mentioned Example 1, a liquid crystal panelis manufactured. In the Comparative Example 1, at the time of therubbing process, dust particles or the like are generated.

Comparative Example 2

Except that the milling process is not performed, a liquid crystal panelis manufactured similarly to Example 1.

Comparative Example 3

Except that the ion beams collide against the transparent conductivefilm of the counter substrate for liquid crystal panel in a verticaldirection in the milling process, a liquid crystal panel is manufacturedsimilarly to Example 1.

Evaluation of Liquid Crystal Panel

With respect to the liquid crystal panels manufactured in the respectiveExamples and Comparative Examples, light transmittance is consecutivelymeasured. The measurement of light transmittance is performed by settingthe temperature of the respective liquid crystal panels to 50° C. andirradiating white light component of light flux density of 151 m/mm² ina state in which a voltage is not applied.

Moreover, the evaluation of the liquid crystal panels is performed witha reference which is a time (a light resistant time) at which lighttransmittance from the irradiation beginning of white light component ofthe liquid crystal panel manufactured in Comparative Example 1 islowered up to 50% as compared with the initial light transmittance, andis divided into four stages as follows.

⊙: The light resistant time is five or more times the ComparativeExample 1.

◯: The light resistant time is two to below five times the ComparativeExample 1.

Δ: The light resistant time is one to below two times the ComparativeExample 1.

x: The light resistant time is below the Comparative Example 1.

In Table 1, various conditions in the milling process, such as an angleθ_(d) of each of the inclined surfaces of the concave portions, theaverage widths W₁ and W₂, the average thickness of the alignment film,the pretilt angles of the respective liquid crystal panel, andevaluation results of the liquid crystal panels, are shown.

TABLE 1 PRESSURE WITHIN COLLISION ANGLE θ_(d) VACUUM ANGLE OFACCELERATION CURRENT OF OF MATERIAL CHAMBER ION BEAM VOLTAGE ION BEAMINCLINED FOR IN MILLING IN MILLING IN MILLING IN MILLING SURFACEALIGNMENT PROCESS PROCESS PROCESS PROCESS OF CONCAVE FILM [Pa] [θ_(b)][V] [mA] PORTION [°] EXAMPLE 1 SiO₂ 1.0 × 10⁻⁴ 3 800 500 3 TO 5 EXAMPLE2 SiO₂ 1.0 × 10⁻⁴ 5 600 500  7 TO 10 EXAMPLE 3 SiO₂ 1.0 × 10⁻⁴ 10 500500 10 TO 12 EXAMPLE 4 SiO 1.0 × 10⁻⁴ 3 800 400  5 EXAMPLE 5 SiO 1.0 ×10⁻⁴ 5 600 400  7 EXAMPLE 6 SiO 1.0 × 10⁻⁴ 10 500 400 10 COMPARA- PI — —— — — TIVE EXAMPLE 1 COMPARA- SiO₂ — — — — — TIVE EXAMPLE 2 COMPARA-SiO₂ 1.0 × 10⁻⁴ 0 800 500 — TIVE EXAMPLE 3 AVERAGE AVERAGE AVERAGE WIDTHWIDTH THICKNESS W₁ OF W₂ OF OF CONCAVE CONCAVE ALIGNMENT PRETILT PORTIONPORTION FILM ANGLE LIGHT [nm] [nm] [μm] [°] RESISTANCE EXAMPLE 1 10 100.05 3 TO 7 ⊚ EXAMPLE 2 10 10 0.05 3 TO 7 ⊚ EXAMPLE 3 10 10 0.05 3 TO 7⊚ EXAMPLE 4 5 5 0.05 3 TO 7 ⊚ EXAMPLE 5 5 5 0.05 3 TO 7 ⊚ EXAMPLE 6 5 50.05 3 TO 7 ⊚ COMPARA- — — 0.03 2 TO 3 — TIVE EXAMPLE 1 COMPARA- — —0.05 — ⊚ TIVE EXAMPLE 2 COMPARA- — — 0.03 — ◯ TIVE EXAMPLE 3

As apparent from Table 1, the liquid crystal panel according to thepresent invention exhibits excellent light resistance as compared withComparative Example 1.

Further, in the liquid crystal panel according to the present invention,it is possible to obtain a sufficient pretilt angle and surely regulatethe alignment state of the liquid crystal molecules. To the contrary, inthe liquid crystal panels according to Comparative Examples 2 and 3, itis impossible to obtain a sufficient pretilt angle, and further it isdifficult to regulate the alignment state of the liquid crystalmolecules.

Evaluation of Liquid Crystal Projector (Electronic Apparatus)

Using the TFT liquid crystal panels manufactured in the respectiveExamples and Comparative Examples, the liquid crystal projector having astructure as shown in FIG. 10 is assembled, and is consecutively drivenfor 5000 hours.

Moreover, as regards the evaluation of the liquid crystal projector, theevaluation of resolution is performed by observing projected images justafter driving and after 5000 hours driving and is divided into fourstates as follows.

⊙: Bright projected images are observed.

◯: Almost bright projected images are observed.

Δ: Slight resolution-deteriorated projected images are observed.

x: Dull projected images are observed.

The evaluation results are shown in Table 2.

TABLE 2 RESOLUTION JUST AFTER AFTER 5000 HOURS DRIVING DRIVING EXAMPLE 1⊚ ⊚ EXAMPLE 2 ⊚ ⊚ EXAMPLE 3 ⊚ ⊚ EXAMPLE 4 ⊚ ⊚ EXAMPLE 5 ⊚ ⊚ EXAMPLE 6 ⊚⊚ COMPARATIVE ⊚ x EXAMPLE 1 COMPARATIVE x x EXAMPLE 2 COMPARATIVE Δ ΔEXAMPLE 3

As apparent from Table 2, in the liquid crystal projector (an electronicapparatus) manufactured using the liquid crystal panels according toExamples 1 to 6, it is possible to obtain bright projected images evenwhen the liquid crystal projector is consecutively driven for a longtime.

To the contrary, in the liquid crystal projector manufactured using theliquid crystal panel according to Comparative Example 1, resolution ofthe projected images is remarkably reduced according to the drivingtime. This may be because, though the alignment of the liquid crystalmolecules is arranged in order at the earlier stage, the alignment filmis deteriorated and the alignment properties of the liquid crystalmolecules are lowered, due to driving for a long time. Moreover, in theliquid crystal projector manufactured using the liquid crystal panelaccording to Comparative Examples 2 and 3, from the beginning of thedriving, bright projected images are not obtained. This may be becausethe alignment property of the inorganic alignment film is originallylow.

Further, the personal computer, the cellular phone and the digital stillcamera comprising the liquid crystal panel according to the presentinvention are manufactured, and the same evaluation is performed onthese apparatuses, such that the same results are obtained.

From these results, it can be seen that the liquid crystal panel and theelectronic apparatus have excellent light resistance and maintain stableproperties even when they are used for a long time.

1. A method of forming an inorganic alignment film made substantially ofan inorganic material on a base substrate, comprising: a milling step ofirradiating ion beams onto a surface of the base substrate, on which theinorganic alignment film is to be formed, from a direction inclined at apredetermined angle θ_(b) with respect to a direction vertical to thesurface; and a film-forming step of forming the inorganic alignment filmon the base substrate onto which the ion beams are irradiated, whereinin the milling step, an acceleration voltage of the ion beams during theirradiation of the ion beams is about 800 to about 1400 V.
 2. The methodof forming an inorganic alignment film according to claim 1, wherein inthe milling step, concave portions having a predetermined directivityare formed in the base substrate by irradiating the ion beams onto thebase substrate.
 3. The method of forming an inorganic alignment filmaccording claim 1, wherein in the milling step, the predetermined angleθ_(b) is at least about 2°.
 4. The method of forming an inorganicalignment film according to claim 1, wherein in the milling step, acurrent of the ion beams to be irradiated is about 100 to about 1000 mA.5. The method of forming an inorganic alignment film according to claim1, wherein in the milling step, a pressure of an atmosphere near thebase substrate is about 5.0×10⁻³ Pa or less.
 6. The method of forming aninorganic alignment film according to claim 1, wherein the film-formingstep further comprises forming the inorganic alignment film by asputtering method.
 7. The method of forming an inorganic alignment filmaccording to claim 1, wherein the inorganic material substantiallycomprises silicon oxide.